CoreFlow Headquarters, Feb 18, 2019 – CoreFlow Ltd., a leading solutions provider of non-contact, advanced handling and conveying systems, is now offering selective vacuum solutions that address the challenges of handling warped wafers. Utilizing its SmartNozzle® technology, CoreFlow’s handling mechanism acquires the wafer even when only a fraction of the vacuum array is covered. This is in contrast to competing technologies, in which a standard vacuum chuck would lose its gripping force and drop the wafer. In order for the vacuum force to acquire a wafer when some of the vacuum ports are uncovered, a selective vacuum is required. Use of permanent flow restrictors chokes the flow, ensuring that all vacuum ports are active – whether or not they are covered.

When comparing the CoreFlow end-effector that utilizes selective vacuum to a conventional product, it was demonstrated that when losing contact in two out of four vacuum pads, the CoreFlow end-effector maintains a vacuum level of slightly over -700 mbar while the standard product generates a level of -50 mbar only! CoreFlow’s selective vacuum pads retain the wafer at a force that is 14 times more powerful than the force generated by the standard vacuum.


For more information about the CoreFlow selective vacuum solutions, please refer to following web page :

www.coreflow.com/solutions/selective-vacuum

About CoreFlow Ltd.
CoreFlow is an industry leader in high-precision, air-floating solutions for critical processes in the Semiconductor and FPD industries. The company develops, manufactures and markets handling, conveying and processing systems used by key equipment manufacturers around the globe.

www.coreflow.com

OLED Inkjet Printing01

FPD Inspection (AOI)02

UV Curing03

Flexible Substrates04.2

Non Contact Chuck for Semiconductor05

Slit Coating06.2

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