Enabling Manufacturing Excellence

High precision air-flow handling and conveying solutions for Semiconductor and FPD manufacturers

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Industries
Industries

Our advanced flow-based solutions are widely implemented in the Semiconductor, Flat Panel Display, and other industries where manufacturing excellence is the key to success.
Technology
Technology

The SmartNozzle™ is at the heart of a wide range of patented, flow-based technologies developed by our team of experts. We have turned these technologies into hundreds of field-proven handling solutions that provide the highest levels of quality and performance.
Our Story
Our Story

We like challenges. With decades of aeromechanical experience in the Flat Panel Display, Semiconductor and other industries, our professional team is ready to address the most rigorous substrate handling requirements.

Explore Our Solutions

Motion Systems

Motion Systems Solutions ~~for Factory Automation
CoreFlow’s aeromechanical solutions for fab automation enable the conveying and handling of substrat...

FPD Inspection

Air Floating Solutions for Defect Inspection (AOI) Systems

High precision non-contact solutions for AOI of any substrate size and thickness

OLED InkJet Printing

Air Floating Solutions for OLED InkJet Printing Systems

Unmatched process zone accuracy and temperature uniformity solutions

Slit Coating

Air Floating Solutions for Photoresist Coating Systems

High precision and optimal air flow uniformity for mura-free processes

UV Curing

Air-Floating Solutions for UV Curing Systems

Combined pressure and vacuum technologies for reliable curing of any substrate size and thickness

Non-Contact Chuck

Wafer Backside Contamination

Unique, reliable wafer active- and back-side clamping solution that eliminates back-side contamination

Ultra-Thin Wafer Handling

Ultra-Thin Wafer Handling

Advanced ultra-thin wafer handling solutions for WLP/FOWLP processes

Warped Wafer Handling

Warped Wafer Handling End Effector

Reliable handling of highly warped wafers enables high process throughput

Selective Vacuum Chuck

Warped Wafer Clamping (SV chuck)

Acquiring and flattening of highly warped wafers at any size and thickness

GripJet™ Chuck for warped wafer

Warped Wafer Flattening with GripJet™ Chuck

Acquiring and flattening of highly warped wafers at any size and thickness

GripJet™ Stage for warped panels

Warped Panels Flattening with GripJet™ Stage

Acquiring and flattening of highly warped panels (PLP) and substrates at any size and thickness
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