SmartNozzle™ technology is at the heart of CoreFlow's non-contact air floating solutions. Thanks to its vertical flow pattern and innovative aerodynamic design, SmartNozzle™ precisely controls the flo... Read More >>
The growing demand for thin and flat panel displays has led FPD manufacturers to push for increased production yields. As a result, glass substrates have become larger – in order to improve efficiency... Read More >>
CoreFlow’s Selective Vacuum (SV) solution addresses the challenges of handling warped substrates. When a warped substrate is placed on a selective vacuum chuck or a stage, some of the vacuum ports (pa... Read More >>
Some critical FPD manufacturing processes, such as OLED inkjet printing or photoresist coating, can cause leakage of material onto pressure/vacuum (PV) handling stages. Leakage of materials may cause... Read More >>
Based on its key technology, the SmartNozzleTM, CoreFlow has developed a set of advanced aeromechanical solutions to address the most rigorous requirements of substrate handlings in the FPD, Semicondu... Read More >>
Motion Systems
High precision non-contact solutions for AOI of any substrate size and thickness
Unmatched process zone accuracy and temperature uniformity solutions
High precision and optimal air flow uniformity for mura-free processes
Combined pressure and vacuum technologies for reliable curing of any substrate size and thickness
Unique, reliable wafer active- and back-side clamping solution that eliminates back-side contamination
Advanced ultra-thin wafer handling solutions for WLP/FOWLP processes
Reliable handling of highly warped wafers enables high process throughput
Acquiring and flattening of highly warped wafers at any size and thickness
Acquiring and flattening of highly warped panels (PLP) and substrates at any size and thickness
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