CoreFlow publishes article on energy-savings in the FPD and semiconductor manufacturing industry

CoreFlow HQ, Israel, July 14, 2021. CoreFlow Ltd., a leading supplier of advanced aeromechanical handling and conveying solutions, published the findings of its energy-cost research with regards to the use of its SmartNozzle^TM air-floating technology for the conveyance of semiconductor and flat-panel display substrates.

In the recently published article, CoreFlow compared the power consumption requirements of its handling systems with those of alternative technologies - porous based air bars and drilled-hole air bars - and concluded that SmartNozzle^TM - based systems consumed up to 77% less energy than its alternatives.

“The article signals the start of our campaign to increase energy-use awareness in the FPD and semiconductor manufacturing communities,” said Ami Herman, CoreFlow’s CEO. “As 'green' considerations become a priority in the industry, manufacturers can look in this direction to reduce operating expenses as well.

Click here to view the full article.

About CoreFlow Ltd.
CoreFlow is an industry leader in high-precision, air-floating solutions for critical processes in the Semiconductor and FPD industries. The company develops, manufactures, and markets handling, conveying, and processing systems used by key equipment manufacturers around the globe.