News

News

Latest news from CoreFlow

CoreFlow Launches the GripJet™ vacuum stage for flattening and handling of warped panels for the Panel-Level Packaging (PLP) manufacturing process

CoreFlow Launches the GripJet™ vacuum stage for flattening and handling of warped panels for the Panel-Level Packaging (PLP) manufacturing process

CoreFlow Ltd. Introduces GripJet™: The Next-Generation Vacuum Chuck for Warped Wafer Gripping and Flattening

CoreFlow Ltd. Introduces GripJet™: The Next-Generation Vacuum Chuck for Warped Wafer Gripping and Flattening

CoreFlow Attend Samsung InkJet Printing Core Technology Seminar

CoreFlow Attend Samsung InkJet Printing Core Technology Seminar

CoreFlow attend SEMICON Taiwan 2022

CoreFlow attend SEMICON Taiwan 2022

CoreFlow attend SEMICON Taiwan 2022

CoreFlow attend SEMICON Taiwan 2022

CoreFlow Opens Operations Facility in Korea – CoreFlow Korea

CoreFlow Opens Operations Facility in Korea – CoreFlow Korea

CoreFlow publishes article on energy-savings in the FPD and semiconductor manufacturing industry

CoreFlow publishes article on energy-savings in the FPD and semiconductor manufacturing industry

CoreFlow Opens a New Demo Center in Japan

CoreFlow Opens a New Demo Center in Japan

CobraMotion™ PV Technology Prevents Damage of Glass Substrates in flat-panel display (FPD) fabrication.

CobraMotion™ PV Technology Prevents Damage of Glass Substrates in flat-panel display (FPD) fabrication.

CoreFlow Announces New Stage Blockage Monitoring System for PV (Pressure Vacuum) air-floating stages

CoreFlow Announces New Stage Blockage Monitoring System for PV (Pressure Vacuum) air-floating stages

CoreFlow Selective Vacuum Technology is Selected to Handle Warped Wafers

CoreFlow Selective Vacuum Technology is Selected to Handle Warped Wafers

Flow Rate Calculator for Pressure-Atmospheric (PA) Handling Solutions

Flow Rate Calculator for Pressure-Atmospheric (PA) Handling Solutions

CoreFlow’s Pressure-Atmospheric air-floating technologies support “weightless” space research experiments

CoreFlow’s Pressure-Atmospheric air-floating technologies support “weightless” space research experiments

CoreFlow’s non-contact chuck reduces backside particle contamination in semiconductor wafers

CoreFlow’s non-contact chuck reduces backside particle contamination in semiconductor wafers

CoreFlow’s Innovative Selective Vacuum Solution Successfully Grips Warped and Bowed Semiconductor Wafers.

CoreFlow’s Innovative Selective Vacuum Solution Successfully Grips Warped and Bowed Semiconductor Wafers.

CoreFlow Mentors High School Students in Product Development and Project Management.

CoreFlow Mentors High School Students in Product Development and Project Management.

CoreFlow to Exhibit at Upcoming SEMICON JAPAN 2019 Show, Wednesday-Friday, Dec 11-13, 2019 - Tokyo Big Site, Tokyo Japan

CoreFlow to Exhibit at Upcoming SEMICON JAPAN 2019 Show, Wednesday-Friday, Dec 11-13, 2019 - Tokyo Big Site, Tokyo Japan

CoreFlow new distributor in Europe – EURIS Semiconductor GmbH.

CoreFlow new distributor in Europe – EURIS Semiconductor GmbH.

COREFLOW to EXHIBIT in SEMICON Europe, 12-15 November 2019 in Messe München, Munich, GermanyM

COREFLOW to EXHIBIT in SEMICON Europe, 12-15 November 2019 in Messe München, Munich, GermanyM

CoreFlow to Exhibit at Upcoming SEMICON TAIWAN 2019 Show, Wednesday-Friday, Sep 18-20, 2019 - TWTC NAGANG HALL, Taipei, Taiwan ROC

CoreFlow to Exhibit at Upcoming SEMICON TAIWAN 2019 Show, Wednesday-Friday, Sep 18-20, 2019 - TWTC NAGANG HALL, Taipei, Taiwan ROC

CoreFlow to Present in SAMSUNG Display Fair 2019, SAMSUNG SPOREX Venue, SUWON, KOREA August 22-23

CoreFlow to Present in SAMSUNG Display Fair 2019, SAMSUNG SPOREX Venue, SUWON, KOREA August 22-23

CoreFlow Announces the Opening of a New Demo Center in Zhubei, Taiwan

CoreFlow Announces the Opening of a New Demo Center in Zhubei, Taiwan

CoreFlow, 20 Years of Excellence

CoreFlow, 20 Years of Excellence

CoreFlow to Launch an Advanced Selective-Vacuum End-Effector Solution for Handling of Highly Warped Wafers

CoreFlow to Launch an Advanced Selective-Vacuum End-Effector Solution for Handling of Highly Warped Wafers

CoreFlow to Exhibit at Upcoming SEMICON Japan 2018 Show, Wednesday-Friday, Dec 12-14, 2018 - Tokyo Big Site, Tokyo Japan

CoreFlow to Exhibit at Upcoming SEMICON Japan 2018 Show, Wednesday-Friday, Dec 12-14, 2018 - Tokyo Big Site, Tokyo Japan

CoreFlow Present in the International Conference On Advances in Fluid Mechanics

CoreFlow Present in the International Conference On Advances in Fluid Mechanics

CoreFlow Present in Display Week 2018, SID/DSCC Business Conference Monday, May 21, 2018 LA Convention Center CA, USA

CoreFlow Present in Display Week 2018, SID/DSCC Business Conference Monday, May 21, 2018 LA Convention Center CA, USA

CoreFlow Develops a non-contact chuck for Semiconductor Silicon Wafers

CoreFlow Develops a non-contact chuck for Semiconductor Silicon Wafers

CoreFlow Installed a Large Air-Floating Stage for Experimental Testing of Spacecraft Attitude and Orbit Control at Technical University of Braunschweig, Germany

CoreFlow Installed a Large Air-Floating Stage for Experimental Testing of Spacecraft Attitude and Orbit Control at Technical University of Braunschweig, Germany

CoreFlow Participate in IHS 2017 CHINA Display Conference – Shanghai, September 7-8

CoreFlow Participate in IHS 2017 CHINA Display Conference – Shanghai, September 7-8

CoreFlow Introduces On-Line Flow Rate Calculator for its Pressure-Atmospheric (PA) Handling Solutions

CoreFlow Introduces On-Line Flow Rate Calculator for its Pressure-Atmospheric (PA) Handling Solutions

CoreFlow introduces its Selective Vacuum solution for Semiconductor Robot End-Effectors, Wafer Chucks and other applications.

CoreFlow introduces its Selective Vacuum solution for Semiconductor Robot End-Effectors, Wafer Chucks and other applications.

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FPD検査

欠陥検査（AOI）システム用のエアフローティングソリューション

あらゆる基板サイズと厚さのAOI向けの高精度非接触ソリューション

モーションシステム

ファクトリーオートメーションのためのモーションシステムソリューション

ファブ自動化のためのCoreFlowの空気力学ソリューションにより、基板とコンベヤー間の接触を最小限に抑えて...

OLEDインクジェット印刷

OLEDインクジェット印刷システム用のエアフローティングソリューション inkjet (JP)

プロセスゾーンと温度均一性ソリューションの比類のない精度

スリットコーティング

フォトレジストコーティングシステム用のエアフローティングソリューション

ムラフリープロセスのための高精度で最適な気流均一性

UV硬化

UV硬化システム用のエアフローティングソリューション

あらゆる基板サイズと厚さの信頼性の高い硬化のための圧力と真空の組み合わせ技術

非接触チャック

ウェーハ裏面の汚染

裏面の汚染を排除する、独自の信頼性の高いウェーハアクティブおよび裏面クランプソリューション

超薄型ウェーハハンドリング

超薄型ウェーハハンドリング

WLP/FOWLPプロセス向けの高度な超薄型ウェーハハンドリングソリューション

反りウェーハの取り扱い

反ったウェーハ向けハンドリングエンドエフェクタ

反りの激しいウェーハを確実に処理することで、全体にわたって高いプロセスが可能になります

セレクティブ　バキュームチャック

の取り扱いセレクティブ　バキューム

任意のサイズと厚さの高度に反ったウェーハの平坦化と取得

その他のソリューションについて

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