News

News

Latest news from CoreFlow

CoreFlow Launches the GripJet™ vacuum stage for flattening and handling of warped panels for the Panel-Level Packaging (PLP) manufacturing process

CoreFlow Launches the GripJet™ vacuum stage for flattening and handling of warped panels for the Panel-Level Packaging (PLP) manufacturing process

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CoreFlow Ltd. Introduces GripJet™: The Next-Generation Vacuum Chuck for Warped Wafer Gripping and Flattening

CoreFlow Ltd. Introduces GripJet™: The Next-Generation Vacuum Chuck for Warped Wafer Gripping and Flattening

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CoreFlow Attend Samsung InkJet Printing Core Technology Seminar

CoreFlow Attend Samsung InkJet Printing Core Technology Seminar

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CoreFlow attend SEMICON Taiwan 2022

CoreFlow attend SEMICON Taiwan 2022

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CoreFlow attend SEMICON Taiwan 2022

CoreFlow attend SEMICON Taiwan 2022

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CoreFlow Opens Operations Facility in Korea – CoreFlow Korea

CoreFlow Opens Operations Facility in Korea – CoreFlow Korea

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CoreFlow publishes article on energy-savings in the FPD and semiconductor manufacturing industry

CoreFlow publishes article on energy-savings in the FPD and semiconductor manufacturing industry

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CoreFlow Opens a New Demo Center in Japan

CoreFlow Opens a New Demo Center in Japan

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CobraMotion™ PV Technology Prevents Damage of Glass Substrates in flat-panel display (FPD) fabrication.

CobraMotion™ PV Technology Prevents Damage of Glass Substrates in flat-panel display (FPD) fabrication.

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CoreFlow Announces New Stage Blockage Monitoring System for PV (Pressure Vacuum) air-floating stages

CoreFlow Announces New Stage Blockage Monitoring System for PV (Pressure Vacuum) air-floating stages

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CoreFlow Selective Vacuum Technology is Selected to Handle Warped Wafers

CoreFlow Selective Vacuum Technology is Selected to Handle Warped Wafers

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Flow Rate Calculator for Pressure-Atmospheric (PA) Handling Solutions

Flow Rate Calculator for Pressure-Atmospheric (PA) Handling Solutions

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CoreFlow’s Pressure-Atmospheric air-floating technologies support “weightless” space research experiments

CoreFlow’s Pressure-Atmospheric air-floating technologies support “weightless” space research experiments

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CoreFlow’s non-contact chuck reduces backside particle contamination in semiconductor wafers

CoreFlow’s non-contact chuck reduces backside particle contamination in semiconductor wafers

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CoreFlow’s Innovative Selective Vacuum Solution Successfully Grips Warped and Bowed Semiconductor Wafers.

CoreFlow’s Innovative Selective Vacuum Solution Successfully Grips Warped and Bowed Semiconductor Wafers.

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CoreFlow Mentors High School Students in Product Development and Project Management.

CoreFlow Mentors High School Students in Product Development and Project Management.

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CoreFlow to Exhibit at Upcoming SEMICON JAPAN 2019 Show, Wednesday-Friday, Dec 11-13, 2019 - Tokyo Big Site, Tokyo Japan

CoreFlow to Exhibit at Upcoming SEMICON JAPAN 2019 Show, Wednesday-Friday, Dec 11-13, 2019 - Tokyo Big Site, Tokyo Japan

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CoreFlow new distributor in Europe – EURIS Semiconductor GmbH.

CoreFlow new distributor in Europe – EURIS Semiconductor GmbH.

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COREFLOW to EXHIBIT in SEMICON Europe, 12-15 November 2019 in Messe München, Munich, GermanyM

COREFLOW to EXHIBIT in SEMICON Europe, 12-15 November 2019 in Messe München, Munich, GermanyM

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CoreFlow to Exhibit at Upcoming SEMICON TAIWAN 2019 Show, Wednesday-Friday, Sep 18-20, 2019 - TWTC NAGANG HALL, Taipei, Taiwan ROC

CoreFlow to Exhibit at Upcoming SEMICON TAIWAN 2019 Show, Wednesday-Friday, Sep 18-20, 2019 - TWTC NAGANG HALL, Taipei, Taiwan ROC

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CoreFlow to Present in SAMSUNG Display Fair 2019, SAMSUNG SPOREX Venue, SUWON, KOREA August 22-23

CoreFlow to Present in SAMSUNG Display Fair 2019, SAMSUNG SPOREX Venue, SUWON, KOREA August 22-23

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CoreFlow Announces the Opening of a New Demo Center in Zhubei, Taiwan

CoreFlow Announces the Opening of a New Demo Center in Zhubei, Taiwan

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CoreFlow, 20 Years of Excellence

CoreFlow, 20 Years of Excellence

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CoreFlow to Launch an Advanced Selective-Vacuum End-Effector Solution for Handling of Highly Warped Wafers

CoreFlow to Launch an Advanced Selective-Vacuum End-Effector Solution for Handling of Highly Warped Wafers

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CoreFlow to Exhibit at Upcoming SEMICON Japan 2018 Show, Wednesday-Friday, Dec 12-14, 2018 - Tokyo Big Site, Tokyo Japan

CoreFlow to Exhibit at Upcoming SEMICON Japan 2018 Show, Wednesday-Friday, Dec 12-14, 2018 - Tokyo Big Site, Tokyo Japan

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CoreFlow Present in the International Conference On Advances in Fluid Mechanics

CoreFlow Present in the International Conference On Advances in Fluid Mechanics

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CoreFlow Present in Display Week 2018, SID/DSCC Business Conference Monday, May 21, 2018 LA Convention Center CA, USA

CoreFlow Present in Display Week 2018, SID/DSCC Business Conference Monday, May 21, 2018 LA Convention Center CA, USA

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CoreFlow Develops a non-contact chuck for Semiconductor Silicon Wafers

CoreFlow Develops a non-contact chuck for Semiconductor Silicon Wafers

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CoreFlow Installed a Large Air-Floating Stage for Experimental Testing of Spacecraft Attitude and Orbit Control at Technical University of Braunschweig, Germany

CoreFlow Installed a Large Air-Floating Stage for Experimental Testing of Spacecraft Attitude and Orbit Control at Technical University of Braunschweig, Germany

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CoreFlow Participate in IHS 2017 CHINA Display Conference – Shanghai, September 7-8

CoreFlow Participate in IHS 2017 CHINA Display Conference – Shanghai, September 7-8

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CoreFlow Introduces On-Line Flow Rate Calculator for its Pressure-Atmospheric (PA) Handling Solutions

CoreFlow Introduces On-Line Flow Rate Calculator for its Pressure-Atmospheric (PA) Handling Solutions

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CoreFlow introduces its Selective Vacuum solution for Semiconductor Robot End-Effectors, Wafer Chucks and other applications.

CoreFlow introduces its Selective Vacuum solution for Semiconductor Robot End-Effectors, Wafer Chucks and other applications.

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探索我們的解決方案

FPD 檢測

適用於缺陷檢測 (AOI) 系統的懸浮式解決方案

高精度非接觸式解決方案，適用於對任何基板尺寸和厚度進行 AOI

傳輸系統

適用於工廠自動化的傳輸系統解決方案

CoreFlow 適用於製造自動化的氣動機械解決方案可在基板與輸送機之間以最少的接觸情況下輸送和處理基板，並...

OLED 噴墨印刷

適用於 OLED 噴墨印刷系統的懸浮式解決方案

無與倫比的加工區精度和溫度均勻性解決方案

狹縫式塗佈

適用於光阻塗佈系統的懸浮式解決方案

高精度和最佳氣流均勻性，適用於需要保證均勻度的工藝

UV 固化

適用於 UV 固化系統的懸浮式解決方案

綜合壓力和真空技術，任何基板尺寸和厚度都能可靠地固化

非接觸夾盤

晶圓背面污染

獨特、可靠的晶圓有源面和背面夾持解決方案，可消除背面污染

超薄晶圓處理

超薄晶圓處理

先進的超薄晶圓處理解決方案，適用於 WLP/FOWLP 工藝

翹曲晶圓處理

翹曲晶圓處理End-effector

可靠處理高度翹曲晶圓，實現高工藝通量

單源多道獨立真空 (Selective Vacuum) 處理系統

單源多道獨立真空 (Selective Vacuum) 處理系統

CoreFlow 的單源多道獨立真空（Selective Vacuum，簡稱 SV）解決方案解決了處理翹曲基板的挑戰。將翹曲基板...

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