News

News

Latest news from CoreFlow

CoreFlow Launches the GripJet™ vacuum stage for flattening and handling of warped panels for the Panel-Level Packaging (PLP) manufacturing process

CoreFlow Launches the GripJet™ vacuum stage for flattening and handling of warped panels for the Panel-Level Packaging (PLP) manufacturing process

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CoreFlow Ltd. Introduces GripJet™: The Next-Generation Vacuum Chuck for Warped Wafer Gripping and Flattening

CoreFlow Ltd. Introduces GripJet™: The Next-Generation Vacuum Chuck for Warped Wafer Gripping and Flattening

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CoreFlow Attend Samsung InkJet Printing Core Technology Seminar

CoreFlow Attend Samsung InkJet Printing Core Technology Seminar

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CoreFlow attend SEMICON Taiwan 2022

CoreFlow attend SEMICON Taiwan 2022

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CoreFlow attend SEMICON Taiwan 2022

CoreFlow attend SEMICON Taiwan 2022

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CoreFlow Opens Operations Facility in Korea – CoreFlow Korea

CoreFlow Opens Operations Facility in Korea – CoreFlow Korea

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CoreFlow publishes article on energy-savings in the FPD and semiconductor manufacturing industry

CoreFlow publishes article on energy-savings in the FPD and semiconductor manufacturing industry

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CoreFlow Opens a New Demo Center in Japan

CoreFlow Opens a New Demo Center in Japan

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CobraMotion™ PV Technology Prevents Damage of Glass Substrates in flat-panel display (FPD) fabrication.

CobraMotion™ PV Technology Prevents Damage of Glass Substrates in flat-panel display (FPD) fabrication.

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CoreFlow Announces New Stage Blockage Monitoring System for PV (Pressure Vacuum) air-floating stages

CoreFlow Announces New Stage Blockage Monitoring System for PV (Pressure Vacuum) air-floating stages

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CoreFlow Selective Vacuum Technology is Selected to Handle Warped Wafers

CoreFlow Selective Vacuum Technology is Selected to Handle Warped Wafers

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Flow Rate Calculator for Pressure-Atmospheric (PA) Handling Solutions

Flow Rate Calculator for Pressure-Atmospheric (PA) Handling Solutions

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CoreFlow’s Pressure-Atmospheric air-floating technologies support “weightless” space research experiments

CoreFlow’s Pressure-Atmospheric air-floating technologies support “weightless” space research experiments

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CoreFlow’s non-contact chuck reduces backside particle contamination in semiconductor wafers

CoreFlow’s non-contact chuck reduces backside particle contamination in semiconductor wafers

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CoreFlow’s Innovative Selective Vacuum Solution Successfully Grips Warped and Bowed Semiconductor Wafers.

CoreFlow’s Innovative Selective Vacuum Solution Successfully Grips Warped and Bowed Semiconductor Wafers.

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CoreFlow Mentors High School Students in Product Development and Project Management.

CoreFlow Mentors High School Students in Product Development and Project Management.

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CoreFlow to Exhibit at Upcoming SEMICON JAPAN 2019 Show, Wednesday-Friday, Dec 11-13, 2019 - Tokyo Big Site, Tokyo Japan

CoreFlow to Exhibit at Upcoming SEMICON JAPAN 2019 Show, Wednesday-Friday, Dec 11-13, 2019 - Tokyo Big Site, Tokyo Japan

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CoreFlow new distributor in Europe – EURIS Semiconductor GmbH.

CoreFlow new distributor in Europe – EURIS Semiconductor GmbH.

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COREFLOW to EXHIBIT in SEMICON Europe, 12-15 November 2019 in Messe München, Munich, GermanyM

COREFLOW to EXHIBIT in SEMICON Europe, 12-15 November 2019 in Messe München, Munich, GermanyM

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CoreFlow to Exhibit at Upcoming SEMICON TAIWAN 2019 Show, Wednesday-Friday, Sep 18-20, 2019 - TWTC NAGANG HALL, Taipei, Taiwan ROC

CoreFlow to Exhibit at Upcoming SEMICON TAIWAN 2019 Show, Wednesday-Friday, Sep 18-20, 2019 - TWTC NAGANG HALL, Taipei, Taiwan ROC

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CoreFlow to Present in SAMSUNG Display Fair 2019, SAMSUNG SPOREX Venue, SUWON, KOREA August 22-23

CoreFlow to Present in SAMSUNG Display Fair 2019, SAMSUNG SPOREX Venue, SUWON, KOREA August 22-23

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CoreFlow Announces the Opening of a New Demo Center in Zhubei, Taiwan

CoreFlow Announces the Opening of a New Demo Center in Zhubei, Taiwan

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CoreFlow, 20 Years of Excellence

CoreFlow, 20 Years of Excellence

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CoreFlow to Launch an Advanced Selective-Vacuum End-Effector Solution for Handling of Highly Warped Wafers

CoreFlow to Launch an Advanced Selective-Vacuum End-Effector Solution for Handling of Highly Warped Wafers

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CoreFlow to Exhibit at Upcoming SEMICON Japan 2018 Show, Wednesday-Friday, Dec 12-14, 2018 - Tokyo Big Site, Tokyo Japan

CoreFlow to Exhibit at Upcoming SEMICON Japan 2018 Show, Wednesday-Friday, Dec 12-14, 2018 - Tokyo Big Site, Tokyo Japan

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CoreFlow Present in the International Conference On Advances in Fluid Mechanics

CoreFlow Present in the International Conference On Advances in Fluid Mechanics

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CoreFlow Present in Display Week 2018, SID/DSCC Business Conference Monday, May 21, 2018 LA Convention Center CA, USA

CoreFlow Present in Display Week 2018, SID/DSCC Business Conference Monday, May 21, 2018 LA Convention Center CA, USA

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CoreFlow Develops a non-contact chuck for Semiconductor Silicon Wafers

CoreFlow Develops a non-contact chuck for Semiconductor Silicon Wafers

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CoreFlow Installed a Large Air-Floating Stage for Experimental Testing of Spacecraft Attitude and Orbit Control at Technical University of Braunschweig, Germany

CoreFlow Installed a Large Air-Floating Stage for Experimental Testing of Spacecraft Attitude and Orbit Control at Technical University of Braunschweig, Germany

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CoreFlow Participate in IHS 2017 CHINA Display Conference – Shanghai, September 7-8

CoreFlow Participate in IHS 2017 CHINA Display Conference – Shanghai, September 7-8

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CoreFlow Introduces On-Line Flow Rate Calculator for its Pressure-Atmospheric (PA) Handling Solutions

CoreFlow Introduces On-Line Flow Rate Calculator for its Pressure-Atmospheric (PA) Handling Solutions

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CoreFlow introduces its Selective Vacuum solution for Semiconductor Robot End-Effectors, Wafer Chucks and other applications.

CoreFlow introduces its Selective Vacuum solution for Semiconductor Robot End-Effectors, Wafer Chucks and other applications.

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探索我们的解决方案

FPD 检测

适用于缺陷检测 (AOI) 系统的悬浮式解决方案

高精度非接触式解决方案，适用于对任何基板尺寸和厚度 AOI系统

适用于工厂自动化的运动系统解决方案

适用于工厂自动化的运动系统解决方案

CoreFlow 适用于制造自动化的气动机械解决方案可在基板与输送机之间以最少的接触输送和处理基板，在保持基...

适用于 OLED 喷墨印刷系统的悬浮式解决方案

适用于 OLED 喷墨印刷系统的悬浮式解决方案

CoreFlow 为 OLED 喷墨印刷系统提供成熟、一流的悬浮式解决方案，以响应制造超薄、柔性、大面积有机 LED (O...

狭缝式涂布

适用于光刻胶涂布系统的悬浮式解决方案

高精度和最佳气流均匀性，适用于需要保证均匀度的工艺

UV 固化

适用于 UV 固化系统的悬浮式解决方案

综合压力和真空技术，为任何基板尺寸和厚度提供可靠的固化制程

非接触夹盘

晶片背面污染

独特、可靠的晶片有源面和背面夹持解决方案，可消除背面污染

超薄晶片处理

超薄晶片处理

先进的超薄晶片处理解决方案，适用于 WLP/FOWLP 工艺

翘曲晶片处理

翘曲晶片处理末端执行器

可靠处理高度翘曲晶片，实现高工艺生产量能

单源多道独立真空 (Selective Vacuum) 夹盘

单源多道独立真空 (Selective Vacuum) 处理系统

抓取和整平任何尺寸和厚度的高度翘曲晶片

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